JPS548680U - - Google Patents
Info
- Publication number
- JPS548680U JPS548680U JP8186177U JP8186177U JPS548680U JP S548680 U JPS548680 U JP S548680U JP 8186177 U JP8186177 U JP 8186177U JP 8186177 U JP8186177 U JP 8186177U JP S548680 U JPS548680 U JP S548680U
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8186177U JPS548680U (en]) | 1977-06-21 | 1977-06-21 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8186177U JPS548680U (en]) | 1977-06-21 | 1977-06-21 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS548680U true JPS548680U (en]) | 1979-01-20 |
Family
ID=29002146
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8186177U Pending JPS548680U (en]) | 1977-06-21 | 1977-06-21 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS548680U (en]) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01303729A (ja) * | 1988-06-01 | 1989-12-07 | Goyo Denshi Kogyo Kk | 混成集積回路における半導体チップの樹脂モールド方法 |
-
1977
- 1977-06-21 JP JP8186177U patent/JPS548680U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01303729A (ja) * | 1988-06-01 | 1989-12-07 | Goyo Denshi Kogyo Kk | 混成集積回路における半導体チップの樹脂モールド方法 |